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Tela Innovations offers innovative, lithography optimized design solutions that lower power, reduce die area and improve performance of integrated circuits in advanced technologies. With the acquisition of Blaze, Tela adds an additional capability to its line up aimed specifically at reducing leakage power. This technology will compliment Tela’s solution of on-grid, straight line, one dimensional layout structures. These lithography-optimized structures enable manufacturing process optimization resulting in significant improvements in performance, power and area.

 

TELA ANNOUNCES ACQUISITION OF BLAZE AND
STRATEGIC PARTNERSHIP WITH TSMC

“TSMC and Tela share a common technology vision of providing a more seamless connection between design and manufacturing such that engineers can achieve their design objectives and hit their market introduction windows with competitive products. We are very pleased with Tela’s move to acquire Blaze DFM and look forward to working with Tela to continue to offer this unique power consumption reduction capability to our customers.”
 
— Fu-Chieh Hsu,
VP of Design & Technology Platform at TSMC


SPIE Advanced Lithography
21 - 25 February 2010
San Jose Convention Center
San Jose, California, USA
Tela Booth #423


46th DAC: Design Automation Conference
July 26 – 31, 2009
Moscone Center
San Francisco, CA
Tela Booth #710
TSMC Booth #822

TELA INNOVATIONS SHOWCASES DESIGN AND PROCESS CO-OPTIMIZATION SOLUTIONS AT 2009 DAC
July 13, 2009

TSMC and TELA INNOVATIONS ANNOUNCE STRATEGIC PARTNERSHIP TO ENHANCE DESIGN AND PROCESS CO-OPTIMIZATION
February 23, 2009

TELA INNOVATIONS ACQUIRES BLAZE DFM
February 23, 2009

Tela Innovations, Inc.
products and technology are covered by patents, patent applications or other intellectual property rights including but not limited to United States patent numbers: 7343581, 7446352, 7100134, 7149999, 7404173, 7337424, 7441211.