Blaze DFM to Exhibit at EDS Fair 2008

What: Electronic Design and Solution Fair 2008
When: January 24-25, 2008
Where: Pacifico Yokohama, Kanagawa, Japan

Blaze DFM, the electrical DFM company, will exhibit its electrical DFM products in the Blaze DFM booth (#303) and in the Itochu Techno-Solutions booth (#807) at the Electronic Design and Solution Fair, on January 24-25, 2008 at the Pacifico Yokohama Exhibition Hall, Kanagawa, Japan.

ED&S Fair is one of the three largest trade shows in the world in the field of semiconductor and electronic system design, showcasing specialized information on advanced device technologies including EDA, ASICs, FPGA/PLDs, IP re-usage, embedded software and design services. The latest trends and targets for further development of electronics technologies will also be featured.

Leakage power is one of the most difficult challenges facing chip designers today. On 65nm designs, over 50% of a chip’s total power consumption is due to leakage. Blaze MO leakage power reduction software lowers leakage power by 20% or more and cuts leakage variability by 50%. It has been proven in silicon on over fifteen 65nm and 90nm designs. It can be used on existing designs and new designs. It does not require any changes to a chip’s architecture, libraries, logic design or layout. Blaze MO is easy to adopt, plugs into existing design flows without any changes to timing signoff or handoff to manufacturing, and is supported by major foundries.

Blaze MO™でリーク電流を削減する

Reduce Leakage Power with Blaze MO

About Blaze DFM
Blaze DFM provides software solutions to fabless semiconductor companies, integrated device manufacturers, and silicon foundries. Blaze products give IC designers greater control over manufacturing variability, improving yield and shortening time to volume production. Blaze DFM, Inc., 1275 Orleans Drive, Sunnyvale, CA 94089, 408.470.4900. Web: http://www.blaze-dfm.com
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